Method and apparatus for plasma treatment of a surface
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United States of America Patent
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Jul 8, 1997
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N/A
app pub date -
Jun 28, 1996
filing date -
Apr 7, 1995
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Abstract
A radiofrequency wave apparatus and method which provides a relatively high concentration of reactive species from a plasma for the treatment of a surface particularly of a substrate (31) with a complex geometry in a holder (62) which masks a portion of the substrate. The radiofrequency waves are preferably microwaves or UHF waves. The apparatus and method is particularly useful for rapid plasma assisted chemical vapor deposition of diamond on a portion of the substrate, particularly on surfaces of objects with complex geometries such as a drill (60) or a seal ring (64).
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