Electronic sensor assembly having metal interconnections isolated from adverse media
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United States of America Patent
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-
Jul 8, 1997
Grant Date -
N/A
app pub date -
Apr 3, 1995
filing date -
Apr 3, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure sensor (32) having a transducer (34) disposed on a top surface of an active die (38). The transducer has a doped region (42), the active die is disposed on a mounting substrate (70), and an interconnect opening (48) is disposed at an edge (90) of the active die. A metal layer (50) is disposed in the interconnect opening and on the top surface of the active die to be in electrical contact with the doped region. A conductive bump (76) is disposed on the mounting substrate in electrical contact with the metal layer and a conductive trace (74) on the mounting substrate.
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