Printed circuit board and heat sink arrangement
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United States of America Patent
Stats
-
Jul 8, 1997
Issued Date -
N/A
app pub date -
Feb 15, 1996
filing date -
Jan 26, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Making a heat sink and printed circuit board assembly by providing a heat exchange element on the heat sink which lies in heat exchange contact with the heat sink and passes therethrough. After locating the board and heat sink in relative positions apart and with the heat exchange element aligned with an electronic component on the board, a settable thermally conductive compound is injected through a hole in the heat exchange element to bond it to the electrical component. The heat sink is detachable from the heat exchange element to expose the side of the board carrying the components so that maintenance or repair may be performed. Subsequently the heat sink is returned into its position in the assembly.
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