Manufacture of etched substrates such as infrared detectors
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United States of America Patent
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-
Jul 15, 1997
Grant Date -
N/A
app pub date -
Oct 20, 1994
filing date -
Feb 26, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A narrow and deep aperture is chemically etched in or through a body of, for example, cadmium mercury telluride or other infrared sensitive material. The etchant is constrained and etches faster adjacent to side walls of a mask on the body. Those side walls are sufficiently close to each other than the faster etching areas overlap. Apertures or slots having a width of about 7 um may be etched in this manner through a thickness of about 5 um via windows having a width of about 3 um in a photo resist of a thickness between 4 and 5 um.
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