Large integrated circuit with modular probe structures
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United States of America Patent
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Jul 15, 1997
Grant Date -
N/A
app pub date -
Nov 30, 1994
filing date -
Nov 30, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A large integrated circuit (10) of modular design, each module (12,14,16) having a circuit section (22,24,34) and a separate dedicated testing pad section (20). Each circuit module (12,14,16) can be individually functionally tested as an independent circuit with conventional prober equipment for defects. Each testing pad section (20) facilitates controlling the entire integrated circuit (10) so that the respective module circuit section (12,14,16) can be tested. Control circuitry (26) comprised of pass gates is provided to isolate the testing pad sections (20) from the operational portion (22,24,34) of the integrated circuit (10) when not under test. The present invention is ideally suited for large spatial light modulators, memory devices and other large sophisticated integrated circuits.
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