Profiled substrate heating
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United States of America Patent
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Jul 22, 1997
Issued Date -
N/A
app pub date -
Jun 7, 1995
filing date -
Oct 29, 1993
priority date (Note) -
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Abstract
An apparatus and method for thermal processing, and more particularly for rapid thermal processing wherein a first thermal radiator generates and projects a first pattern of thermal radiation onto a first surface of a substrate, and wherein a second thermal radiator generates and projects a second pattern of thermal radiation onto a second surface of the substrate. The temperatures on the first and second surfaces are sensed by sensing means. Means for controlling the first and second thermal radiator means in response to the sensing means cause a prescribed temperature profile to be produced within the substrate.
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