Graphite composites for electronic packaging
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United States of America Patent
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-
Jul 22, 1997
Grant Date -
N/A
app pub date -
Apr 5, 1993
filing date -
Apr 5, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is provided a component for use in electronic packaging. The component is a composite having a graphite matrix which is infiltrated with a metal or a metal alloy and the external surfaces of the composite then coated with a metallic layer to provide environmental and mechanical protection. The packaging components are lightweight, have a coefficient of thermal expansion close to that of a silicon based integrated circuit device and further, have a high coefficient of thermal conductivity.
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