Direct bonded heat spreader

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5650662
SERIAL NO

08293510

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Abstract

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A heat spreader formed of copper or copper alloys is direct bonded to an electronic device package which includes a multilayer substrate formed of alternating layers of ceramic and metallic plating.

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Patent Owner(s)

Patent OwnerAddress
AAVID THERMALLOY LLC1 AAVID CIRCLE LACONIA NH 03246

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edwards, Steven F 702 N. Oak Cliff Blvd., Dallas, TX 75208 2 104
Maier, Peter Hugo Dietz Str. 19, 8650 Lauf, DE 61 690
Shultz-Harder, Jurgen Hugo Dietz Str. 32, 8650 Lauf, DE 1 85

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