Electronic package with improved thermal properties
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United States of America Patent
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-
Jul 22, 1997
Grant Date -
N/A
app pub date -
Jul 3, 1995
filing date -
Jul 3, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic package having improved thermal performance. In the case of a plastic package, the inner ends of the leads of the lead frame are attached to a heat slug by a high thermal conductivity material such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the leadframe are attached to the metal base component by a high thermal conductivity material.
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