Homogenous and flexible or rigid combinations of materials moldable and adhesive at temperature below 90.degree.C
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United States of America Patent
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Jul 29, 1997
Grant Date -
N/A
app pub date -
Mar 7, 1995
filing date -
Sep 7, 1992
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Abstract
Combinations of IPN type molecular or intramolecular materials, which are thermoadhesive at temperatures not exceeding 90.degree. C. and which can be molded and shaped at said temperature, are characterized in that they contain a first rubber-like elastoviscous constituent having a softening point not exceeding 90.degree. C. and a second, semi-cristalline constituent essentially of the polyester type having a fusion temperature of 35.degree. to 80.degree. C. These combinations have controlled adhesiveness and adequate fluidity for application by hand particularly in do it yourself applications, orthopedics, sport and physiotherapy, and as an adhesive material on rough or porous bodies.
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