Lightweight thermally responsive mold for resin transfer molding
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United States of America Patent
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Aug 5, 1997
Grant Date -
N/A
app pub date -
Feb 15, 1996
filing date -
Feb 15, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lightweight thermally responsive mold for use with a resin transfer molding process is provided. The mold includes first and second support frames including a plurality of upstanding intersecting support ribs. First and second substrates are supported by the first and second support frames, respectively, for carrying heating tubes therein. First and second hard shells are supported by the first and second substrates, respectively. The shells cooperate to form a mold cavity therebetween. Each shell is less than approximately 10 mm thick in order to provide a low thermal mass and high thermal responsiveness.
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