Interconnect structure with programmable IC for interconnecting electronic components, including circuitry for controlling programmable IC
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United States of America Patent
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Aug 5, 1997
Issued Date -
N/A
app pub date -
Jan 31, 1996
filing date -
Oct 15, 1990
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An interconnect structure is centered around a substrate having multiple component contacts for receiving electronic components. Multiple conductive traces are provided on the substrate. Each conductive trace is electrically connected to one of the component contacts. A programmable IC having a group of separate conductive leads is connected to the substrate. Two or more of the conductive leads are connected to corresponding conductive traces on the substrate. The IC has programmable elements for selectively connecting the conductive leads, thereby enabling a user to interconnect selected conductive traces on the substrate to achieve a desired electrical function from the electronic components connected to the substrate. The interconnect structure also contains circuitry for transmitting control signals to the programmable IC to control its configuration so as to control the interconnection of the conductive traces.
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