Semiconductor device having tape automated bonding leads
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United States of America Patent
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-
Aug 5, 1997
Issued Date -
N/A
app pub date -
Nov 18, 1994
filing date -
Jun 1, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plurality of electrode pads are formed on a main surface of a semiconductor chip. The electrode pads on the semiconductor chip are electrically connected to the top end of an inner lead through a metal plating layer.
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