Semiconductor device having upper and lower package bodies and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 12, 1997
Issued Date -
N/A
app pub date -
Feb 16, 1996
filing date -
Sep 9, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device in which molding resin is not adhered on test pads of leads extending from a junction of an upper package half-body and a lower package half-body. The semiconductor device can effectively release heat generated by a semiconductor chip molded in a package of the semiconductor device. The semiconductor device includes a semiconductor chip having a plurality of leads connected thereto. A package of the semiconductor device is formed by means of molding. The package is constructed of a first package portion and a second package portion integrally formed into one package. The first package portion has a horizontal section smaller than that of the second package portion so that a portion of each of the leads extends from a part of the package between the first package portion and the second package portion and is exposed on a surface of the second package portion. The semiconductor chip is positioned within the second package portion. A supporting member is provided in the second package portion for supporting the portion of each of the leads and is located inside the second package portion so as to prevent deformation of the leads during molding of the package.
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