Tab tape-based bare chip test and burn-in carrier
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United States of America Patent
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Aug 12, 1997
Grant Date -
N/A
app pub date -
Feb 14, 1995
filing date -
Feb 14, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
TAB tape is used to contact integrated circuit chip electrodes (without actual metallurgical bonding) at approximately 10 grams per lead contact force. The chip is clamped to the TAB leads, and held in place so that the tape site can be transported, tested, and burned-in like a TAB chip on tape. A TAB tape frame is utilized with the inner lead bond fingers angled upwards so that the ends of the fingers perform a scrubbing action on the chip contacts when the IC chip is engaged with the TAB tape slide carrier socket. A silicone bead provides a spring-like action underneath the fingers.
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