Microstructure, process for manufacturing thereof and devices incorporating the same
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United States of America Patent
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Aug 19, 1997
Grant Date -
N/A
app pub date -
Jan 26, 1995
filing date -
Jan 31, 1994
priority date (Note) -
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Abstract
A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1). The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure. The microstructure can have application as electrostatic actuator etc., depending on choice of shape and composition.
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