Ultrasonic bonding process
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United States of America Patent
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Aug 26, 1997
Grant Date -
N/A
app pub date -
Jan 17, 1995
filing date -
Jan 17, 1995
priority date (Note) -
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Abstract
A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).
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