Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
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United States of America Patent
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Aug 26, 1997
Grant Date -
N/A
app pub date -
Mar 29, 1996
filing date -
Mar 29, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
An method for depositing solder onto the pad-on and pad-off via contacts of a substrate is disclosed. In one embodiment the present invention includes positioning a mask having a first opening of a first diameter and a second opening of a second diameter over a substrate having both pad-on and pad-off via contacts. The substrate is positioned over the substrate such that the first opening is positioned over the pad-on via contact and the second opening is positioned over the pad-off via contact. Solder of a first volume and solder of a second volume are deposited onto the pad-on and pad-off via contacts, respectively, by forcing a solder paste through the mask openings. In this manner, solder bumps having a uniform height and volume above the pad-on via contact plane is established after reflowing the deposited solder.
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