Sputter coating power processing portion
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United States of America Patent
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Aug 26, 1997
Grant Date -
N/A
app pub date -
Jul 28, 1994
filing date -
Jul 28, 1993
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A sputtering method comprises applying a negative voltage intermittently in a constant periodic cycle to a cathode disposed in a vacuum chamber, wherein the negative voltage is intermittently applied so that a time during which the negative voltage is not applied includes a time during which the voltage is controlled to be zero volt in a range of from 10 .mu.s to 10 ms, and the zero voltage time is equal to or longer than the time required by one arcing from its generation to extinction.
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