Method of bonding an aluminum wire to an intergrated circuit bond pad
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 26, 1997
Grant Date -
N/A
app pub date -
Sep 30, 1994
filing date -
Sep 30, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for manufacturing bonding pad adapted for use with an aluminum wire that resists stresses that would otherwise peel the pad from the substrate. The pad has a polysilicon layer adhered to an insulating layer on a semiconductor substrate, a overlying refractory metal polycide layer, a second polysilicon layer, a refractory metal layer, and a thick aluminum alloy bonding pad.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully