Real-time in-line testing of semiconductor wafers
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United States of America Patent
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Aug 26, 1997
Grant Date -
N/A
app pub date -
Mar 1, 1995
filing date -
Mar 1, 1995
priority date (Note) -
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Abstract
An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modulated light, within the probe assembly, having a predetermined wavelength and frequency of modulation, impinges upon the wafer. A sensor in the probe assembly measures the surface photovoltage induced by the modulated light. A computer then uses the induced surface photovoltage to determine various electrical characteristics of the wafer.
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