Method of encapsulating die and chip carrier
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United States of America Patent
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Sep 2, 1997
Grant Date -
N/A
app pub date -
May 19, 1994
filing date -
May 19, 1994
priority date (Note) -
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Abstract
A method of packaging a semiconductor chip assembly includes the encapsulation of the same after establishing an encapsulation area and providing a physical barrier for protecting the terminals of a chip carrier. An alternative or supplement to providing a physical barrier is to provide a preform of an encapsulation material which includes a predetermined volume of such material so that only the encapsulation area is filled. For a semiconductor chip assembly which does not yet have an elastomeric layer, a method of simultaneously forming such an elastomeric layer and encapsulating a semiconductor chip assembly is also provided.
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