Ball grid array package with lead frame
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United States of America Patent
Stats
-
Sep 2, 1997
Grant Date -
N/A
app pub date -
Oct 17, 1995
filing date -
Oct 17, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A ball grid array (BGA) package incorporates a lead frame which includes a die attach pad and a plurality of leads radiating away from the die attach pad. A die is mounted on the die attach pad and electrically connected to the leads by wire bonding. A non-conductive solder mask or tape is applied to the lead frame which defines a number of selectively positioned vias (openings). A molded plastic casing or a cap is positioned over the die, wiring and lead frame to encapsulate the package. Solder balls or columns are attached to selected leads of the lead frame through the vias.
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Family
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Cited Art Landscape
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