Electrical circuit bonding interconnect component and flip chip interconnect bond
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United States of America Patent
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-
Sep 2, 1997
Issued Date -
N/A
app pub date -
Oct 23, 1995
filing date -
Dec 13, 1993
priority date (Note) -
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Abstract
An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bonding interconnect is used to bond a die pad to a supporting substrate thereby forming a surface mount device.
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