High density termination system with molded-on strain relief frame, and method
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United States of America Patent
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Sep 9, 1997
Grant Date -
N/A
app pub date -
Apr 10, 1996
filing date -
Apr 10, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A termination for a plurality of electrical conductors of a substrate includes a strain relief frame molded to the substrate, a connector housing having a plurality of electrical terminals positioned with respect to the frame to orient the terminals with respect to the conductors, and a plurality of the terminals being electrically connected to respective electrical conductors, the connections being made subsequent to the molding of the strain relief to the substrate. A cable termination assembly made by the process of molding a strain relief to a substrate having plural conductors in positional relation, said molding including leaving exposed connecting portions of respective conductors, subsequently attaching plural terminals respectively to exposed connecting portions of said conductors. A method of making a termination assembly includes molding a strain relief to a substrate having plural conductors in positional relation, said molding including leaving exposed connecting portions of respective conductors, subsequently attaching plural terminals respectively to exposed connecting portions of said conductors.
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