Micro-electromechanical die module with planarized thick film layer
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United States of America Patent
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Sep 9, 1997
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app pub date -
Oct 17, 1994
filing date -
Oct 17, 1994
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Abstract
An improved microelectromechanical device, such as a thermal ink jet die or printhead, is formed by the alignment of two planar substrates bonded together by an intermediate thick film layer of patterned polymeric material, such as polyimide. The improved device has a fully cured, patterned thick film layer which is planarized by chemical-mechanical polishing-to improve the bonding strength between the substrates. The planarization removes topographical formations generated during the deposition of the thick film layer and/or during the patterning of the recesses therein.
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