Method for manufacturing a semiconductor device wherein electrodes on a semiconductor chip are electrically connected to lead terminals by plating bonding
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United States of America Patent
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Sep 9, 1997
Grant Date -
N/A
app pub date -
Jan 26, 1996
filing date -
Apr 12, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
According to a face-down-mounting semiconductor device wherein electrode pads on a semiconductor chip and lead terminals are electrically connected to each other by plating bonding, and a method of manufacturing the semiconductor device, a guide tool is placed on the surface of a semiconductor chip. The guide tool includes guide holes corresponding in position to electrode pads. Columnar lead terminals are inserted into the guide holes of the guide tool. In this state, the semiconductor chip is soaked in a plating solution, together with the guide tool, to execute plating bonding. Since, therefore, the lead terminals can be brought into reliable contact with the electrode pads, metal plating layers can be grown sufficiently between them, thereby improving in reliability of melting bonding.
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