Flip chip semiconductor device
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United States of America Patent
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-
Sep 9, 1997
Grant Date -
N/A
app pub date -
Sep 6, 1996
filing date -
Mar 27, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor device for life enhancement of electrical connections between a semiconductor chip and a mounting substrate. Protruding electrodes, each including a bump electrode and a land electrode, are located on the lower surface of an LSI chip. The bump electrodes are substantially spherical and have a first thickness. Connecting terminals of substantially spherical configuration and having a second thickness are directly connected to corresponding land electrodes by melting. Connecting patterns are located on the upper surface of a wiring board which is larger in area than the LSI chip in plan configuration, and external electrodes, each including a connecting pattern and an external electrode, are located on the lower surface of the wiring board. The external electrodes are substantially spherical and have a third thickness. The connecting patterns are directly connected to corresponding connecting terminals, respectively, by melting.
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