Method and apparatus for testing an integrated circuit
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United States of America Patent
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Sep 9, 1997
Grant Date -
N/A
app pub date -
Oct 23, 1996
filing date -
Oct 23, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method for laser ablating residue off of probe tips. In one embodiment, the probe tips of the probe needles (16) contact the test pads of an integrated circuit on a wafer (18). The probe tips build up a residue over time. This residue is due to the probe tips coming into contact with integrated circuit wafer layers such as layers (114), (120), (122), (124), and (126). This residue can be vaporized from the surface of the probe needles via exposure to a laser light. The probe needles (16) are exposed to a laser light created by a laser source (28) and ported to the probe tips by a fiber optic cable (26).
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