Method and apparatus for monitoring and controlling the dispensing of materials onto a substrate
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United States of America Patent
Stats
-
Sep 9, 1997
Grant Date -
N/A
app pub date -
Jul 31, 1995
filing date -
Jul 31, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A dispensing system includes a robot that controls the positional location of a dispenser that dispenses a bead of material, such an adhesive, onto a substrate and wherein a sensor monitors the geometric configuration of the material dispensed. The dispensing system also includes a control circuit which receives information from the sensor so as to monitor geometric characteristics such as height, width and cross sectional area in such a manner that statistical process data can be gathered and also to provide alarm indications whenever the height or width of the bead do not comply with predetermined characteristics. The control circuit also provides a closed loop feedback system so that the supply of material and the nozzle can be controlled in such a manner to modify the flow of bead material whenever a discrepancy or error is detected by the control circuit.
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