Method of manufacturing printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 16, 1997
Grant Date -
N/A
app pub date -
Mar 15, 1995
filing date -
Apr 14, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.
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