Method for processing semiconductor wafer with reduced particle contamination during saw
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United States of America Patent
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Sep 16, 1997
Grant Date -
N/A
app pub date -
Aug 23, 1995
filing date -
Aug 23, 1995
priority date (Note) -
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Abstract
A method of processing a semiconductor wafer (12) to form micromechanical devices. Extended scribe lines (20) are provided from centrally located integrated circuit scribe lines (16) to provide a saw street that extends to the perimeter of the wafer. Micromechanical devices (14), including those of the DMD type, can be fabricated without a layer of protective oxide while reducing the generation of conductive particles during the wafer saw process which could otherwise degrade the operation of the micromechanical devices having movable elements. The extended scribe lines (20) are fabricated at the same time that the conventional scribe lines (16) are formed about the integrated circuits (14).
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