Semiconductor device with a film carrier tape
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 16, 1997
Grant Date -
N/A
app pub date -
Sep 14, 1995
filing date -
Sep 14, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a semiconductor device which has a semiconductor IC chip, a base film forming a basis of a film carrier tape, through-holes and device holes which open in the base film, a copper-foil wiring formed on the base film, inner leads formed at the inside end of the copper-foil wiring, lands for connecting to outside, apertures formed in the center of the respective lands, cover resist formed on the base film except the lands, sealing resin for protecting the semiconductor IC chip and solder bumps.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully