Patternable particle filled adhesive matrix for forming patterned structures between joined surfaces
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United States of America Patent
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-
Sep 23, 1997
Grant Date -
N/A
app pub date -
Oct 7, 1994
filing date -
Feb 14, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A patternable bonding material for joining the surfaces of two or more substrates permits localization of conductive or insulating hard-cored particles within an adhesive matrix to form patterned structures on or between the surfaces. Electrical, thermal, or mechanical energy may be transferred through, or isolated by the material. The material may be used in an uncured state to allow easy separation of the joined surfaces, or a more permanent bond may be formed. The adhesive may be cured by thermocuring, evaporation or ablation of organic components, pressure, or by the application of ultraviolet radiation.
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