Integrated circuit package with internally readable permanent identification of device characteristics
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 23, 1997
Grant Date -
N/A
app pub date -
Dec 29, 1995
filing date -
Sep 29, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit (IC) device package that includes permanent identification regarding the device characteristics, wherein the permanent identification are at or below the surface of the package and may indicate the operating frequency of an IC die within the package, as well as voltage requirements, etc.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully