Method of manufacturing a hybrid chip card
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United States of America Patent
Stats
-
Sep 30, 1997
Issued Date -
N/A
app pub date -
Oct 4, 1995
filing date -
Feb 13, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a hybrid chip card comprises the steps of providing a card body; forming a cavity in the card body; mounting the electronic module in the cavity of the card body; and connecting an antenna to the electronic module. The cavity opens out on a face of the card body and is adapted for receiving an electronic module. The electronic module includes an integrated circuit chip. The mounting step further includes the step of exposing a plurality of contact pads of the electronic module on the outer surface of the card. The plurality of contact pads permit contact communication between the electronic module and the chip card reader, and the antenna permits contact-free communication between the electronic module and the chip card reader. The hybrid chip card thus manufactured is capable of both contact and contact-free communication with a chip card reader.
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