Method of making solder balls by contained paste deposition
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United States of America Patent
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-
Sep 30, 1997
Grant Date -
N/A
app pub date -
Mar 19, 1996
filing date -
Aug 8, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
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