Interdigitated wirebond programmable fixed voltage planes
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United States of America Patent
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Sep 30, 1997
Grant Date -
N/A
app pub date -
Jul 29, 1996
filing date -
Feb 7, 1995
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Two interdigitated comb-shaped fixed voltage buses such as a power bus and ground bus, in the form of metallization are provided substantially encircling of an integrated circuit die in an integrated circuit package or other integrated die assembly. Any selection of bonding pads on the die and metallization leads in the assembly may be connected to the fingers of either bus. The length of wire bond or TAB connections and the area occupied by the buses is minimized by the interdigitated geometry of the buses.
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