Discrete packaging system for electronic device
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United States of America Patent
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Oct 7, 1997
Grant Date -
N/A
app pub date -
Jun 26, 1995
filing date -
Jun 26, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A packaging system includes a bottom having a flat surface for accepting an object, a top having a flat surface and projecting fingers extending from the surface of the top. When the top is assembled to the bottom, the fingers deform, forcing the object against the bottom surface. The object is maintained in position by friction against the bottom surface and the presence of undeformed fingers surrounding the object. The packaging system may be made of static dissipative material and include connection claws and rods for connecting a number of packages in series.
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