Solder anchor decal and method
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United States of America Patent
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-
Oct 7, 1997
Grant Date -
N/A
app pub date -
Aug 24, 1995
filing date -
Aug 24, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes and mold cells, and is then allowed to cool to solidify therein. The mold may be separated from the decal strip to form the solder decal containing solder beads each having a stem mechanically joined to the strip at respective ones of the anchor holes. Various forms of the solder decal are used for transferring the solder beads to a substrate or chip, or effecting temporary connections for conducting burn-in and testing, or accommodating thermal mismatch for example.
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