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United States of America Patent

PATENT NO 5674351
SERIAL NO

08333924

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Holes are formed in a structure (116) by a technique in which a die (118) having openings (119) at desired locations for the holes is first placed over one side of the structure. Fluid pressure is applied to the other side of the structure to cause material to be sheared away from the structure at the desired hole locations, thereby forming the holes. A die (117) having openings (119) at the desired hole locations can also be placed over the side subjected to the fluid pressure to facilitate the hole-formation process. With two such die in place, fluid containing an abrasive material can be passed through unfinished holes to remove rough edges and finish the holes.

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Patent Owner(s)

Patent OwnerAddress
CANON KABUSHIKI KAISHA30-2 SHIMOMARUKO 3-CHOME OHTA-KU TOKYO 1468501 ?1468501

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lovoi, Paul A Saratoga, CA 87 2934

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