Method for metallizing non-conductive substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 7, 1997
Grant Date -
N/A
app pub date -
Apr 12, 1996
filing date -
Jul 16, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable reagent, and (d) electrolytically depositing at least one metal film (11) on said film (9).
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully