Method of manufacturing a copper-nickel-silicon alloy casing
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United States of America Patent
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Oct 14, 1997
Grant Date -
N/A
app pub date -
Apr 26, 1995
filing date -
Apr 29, 1994
priority date (Note) -
Expired
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Abstract
The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The method permits an alloy with a very high elastic limit with very good conductivity and good cold reformability and differs from the conventional method of manufacturing such alloys by heating to about 950.degree. C. and fairly rapid cooling after a preceding cold rolling operation. An improvement in the properties can be achieved by ageing of the alloy at 300.degree. C. to 600.degree. C. for several hours.
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