Molded printed circuit board with wipe-in connector and method of making same
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United States of America Patent
Stats
-
Oct 14, 1997
Grant Date -
N/A
app pub date -
Jul 25, 1994
filing date -
Jul 25, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An automotive instrument cluster case is molded of a resin material. A rigid rear wall of the case has a planar outer surface including a connector region having two adjacent flaps, each flap molded with a thin flexible section and a rigid terminal section. Printed circuit paths are applied to the plane outer surface including the flaps. Then the flaps are deformed into the case, with the flexible section being curved and the terminal sections being spaced apart with the circuit paths forming terminal strips facing one another to form a connector socket. Interlocking stop elements molded on the inner surface hold the flaps apart to receive a male connector.
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Family
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Cited Art Landscape
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