Method of bonding a contact-type thin film magnetic head element to a supporting beam
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United States of America Patent
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Oct 14, 1997
Grant Date -
N/A
app pub date -
Jan 30, 1996
filing date -
Jan 31, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of bonding a contact-type thin film magnetic head element to a beam for supporting the head element in a contact-type thin film magnetic head during a process of producing the magnetic head is disclosed. A connecting pad of the magnetic head element is made contact with a signal conductor of the supporting beam. Then, a vibration energy of an ultrasonic wave is applied to the contact portion so that the surfaces of the components in the contact portion are caused to diffuse into each other. As a result, a state in which the connecting pad is mechanically coupled and electrically connected to the signal conductor is obtained.
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