Process for forming a thin microcrystalline silicon semiconductor film

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United States of America Patent

PATENT NO 5677236
SERIAL NO

08605609

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Abstract

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A thin microcrystalline silicon semiconductor film suitable for use as an intrinsic semiconductor layer in an amorphous silicon solar cell or the like. The thin microcrystalline silicon semiconductor film comprises an amorphous phase with crystallites contained therein in the form of a prismatic or conical crystallite aggregate phase. Additional crystallites may be dispersed as individual crystallites in the amorphous phase. In the thin film, the crystalline fraction may preferably range from 5 to 80% and the crystallite size may preferably range from 2 to 1,000 nm. This thin film can be formed by first forming an initial film to a thickness in a range of from 2 nm to 100 nm at a deposition rate of from 0.01 nm/sec to 0.1 nm/sec on a substrate and then forming a principal film at a deposition rate of from 0.1 nm/sec to 2 nm/sec, for example, in accordance with RF plasma CVD.

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Patent Owner(s)

Patent OwnerAddress
MITSUI CHEMICALS INC2-1 YAESU 2-CHOME CHUO-KU TOKYO 1040028 ?1040028

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ashida, Yoshinori Kanagawa-ken, JP 5 277
Fukuda, Nobuhiro Kanagawa-ken, JP 62 915
Fukuda, Shin Kanagawa-ken, JP 47 957
Ishiguro, Nobuyuki Kanagawa-ken, JP 1 90
Sadamoto, Mitsuru Kanagawa-ken, JP 6 147
Saitoh, Kimihiko Kanagawa-ken, JP 2 96

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