Leads between chips assembly
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United States of America Patent
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Oct 14, 1997
Grant Date -
N/A
app pub date -
Jun 17, 1996
filing date -
Jun 17, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A device and method for increasing integrated circuit density comprising at least a pair of superimposed dice, wherein at least one of the superimposed dice has at least one bond pad variably positioned on an active surface of the die. A plurality of lead fingers from a leadframe extend between the dice. The leadframe comprises at least one lead with leads of non-uniform length and configuration to attach to the differently positioned bond pads of the multiple dice. An advantage of the present invention is that it allows dice with differing bond pad arrangements to be used in a superimposed configuration to increase circuit density, while eliminating the use of bond wires in such a configuration.
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