Electrostatic chuck with mechanism for lifting up the peripheral of a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 14, 1997
Grant Date -
N/A
app pub date -
Nov 22, 1996
filing date -
Nov 24, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrostatic chuck applicable to, e.g., an epitaxial apparatus or an etching apparatus for electrostatically chucking a semiconductor substrate or wafer is disclosed. The chuck includes a stage for electrostatically retaining the wafer thereon. A plurality of lift pins are elevatable to thrust up the wafer. A plurality of release pins are arranged on the stage for thrusting up the peripheral portion of the wafer. A plurality of drive mechanisms respectively thrust up the release pins stepwise within the allowable elastic deformation range of the wafer. A control device selectively actuates the release pins via the associated drive mechanisms.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully