Method and apparatus for drying a substrate having a resist film with a miniaturized pattern
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United States of America Patent
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Oct 14, 1997
Grant Date -
N/A
app pub date -
Apr 4, 1995
filing date -
Apr 6, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of processing a substrate includes the steps of developing a substrate having a photo-sensitive resin film formed on its surface; washing the substrate by supplying washing liquid to the surface of the substrate, and rotating the substrate on a perpendicular axis in a horizontal plane and thereby drying the surface of the substrate, and atmosphere in which the substrate is placed is adjusted to be at a pressure lower than the atmospheric pressure in the step of drying the surface of the substrate. Instead of or in addition to this, washing liquid in which prescribed gas is dissolved may be used in the step of washing the substrate. In this case, in the step of drying the surface of the substrate, washing liquid supplied to the surface of the substrate is preferably supersaturated with gas. A substrate processing apparatus including a controller for implementing such a method is also disclosed.
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