Uses of uniaxially electrically conductive articles
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United States of America Patent
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-
Oct 21, 1997
Issued Date -
N/A
app pub date -
Jun 6, 1995
filing date -
Feb 5, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Polymer (preferably polyimide) sheets with laser ablated through-holes plated with metal are used for making electrical connections to specified microcircuits, especially unbumped microchips and Tape Automated Bonding (TAB) articles. Bonding with different melting-point materials at opposite ends of the plated holes is disclosed. Preferred polyimides are those derived from polymerisation of 4-4'-biphenyldianhydride and (4,4'-diaminobiphenyl, or 4,4'-diaminobiphenylether, or phenylenediamine, preferably p-phenylenediamine).
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